Standards: Electronics Assembly: Solderability

19 Products

Member: $79.00

Nonmember: $158.00

IPC-7530A: 群焊工艺温度曲线指南(再流焊和波峰焊

Member: $68.00

Nonmember: $137.00

IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试

Member: $68.00

Nonmember: $137.00

IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试

Member: $79.00

Nonmember: $155.00

IPC-4556: 印制板化学镍/钯/浸金(ENEPIG)规范

Member: $68.00

Nonmember: $137.00

EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English

Member: $68.00

Nonmember: $137.00

EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...

Member: $84.00

Nonmember: $168.00

IPC-J-STD-003C-WAM1&2: Solderability Tests for Printed Boards - English

Member: $289.00

Nonmember: $565.00

IPC-4550-FAM: Plating Specifications

Member: $284.00

Nonmember: $560.00

7090-FAM: Packages for PCBs and Assemblies

Member: $298.00

Nonmember: $568.00

SolMatFAM: Solder Materials Family

Member: $65.00

Nonmember: $131.00

IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

Member: $84.00

Nonmember: $168.00

IPC-7095C: Design and Assembly Process Implementation for BGAs

Member: $79.00

Nonmember: $155.00

IPC-A-610FC: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies

Member: $67.00

Nonmember: $129.00

J-STD-001FS WAM 1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical...

Member: $60.00

Nonmember: $119.00

IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

Member: $84.00

Nonmember: $168.00

IPC-A-610FC: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies

Member: $62.00

Nonmember: $124.00

J-STD-001FS-WAM1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic...

Member: $62.00

Nonmember: $124.00

J-STD-001FS: Space Applications Electronic Hardware Addendum to J-STD-001F

Member: $79.00

Nonmember: $155.00

IPC-7095C: Design and Assembly Process Implementation for BGAs