Standards: Electronics Assembly: Solderability

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IPC-HDBK-005: 焊膏评估指南

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IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC-4556: 印制板化学镍/钯/浸金(ENEPIG)规范

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4562A-CN: 印制板用金属箔

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J-STD-004B-CN: 修订本 1 助焊剂要求

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J-STD-001E-CN: Rev E superseded by Rev F

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J-STD-003C-CN-WAM1: 印制板可焊性测试

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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...

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T-50H-CN: 电子电路互连与封装术语及定义

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J-004A-CN: SUPERSEDED BY J-STD-004B-CN

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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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J-STD-003C-CN-WAM1: 印制板可焊性测试