Standards: Electronics Assembly: Solderability

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J-STD-001E-CN: Rev E superseded by Rev F

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J-STD-003C-CN-WAM1: 印制板可焊性测试

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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...

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T-50H-CN: 电子电路互连与封装术语及定义

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J-004A-CN: SUPERSEDED BY J-STD-004B-CN

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J-STD-001D-SP: Requirements for Soldered Electrical and Electronic Assemblies

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J-STD-001E-SP: Requisitos de Ensambles Eléctricos y Electrónicos Soldados

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J-STD-001E-FR: Exigences des Assemblages Electriques et Electroniques Brasés

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J-STD-001D-IT: Requirements for Soldered Electrical and Electronic Assemblies

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J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies

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J-STD-001D: Rev D superseded by Rev E

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IPC-HDBK-005: Guide to Solder Paste Assessment

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J-004A: SUPERSEDED BY J-STD-004B

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J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies

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1752A-WAM1-2: Materials Declaration Management with Amendments 1 & 2

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J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-8701: Final Acceptance Criteria Standard for PV Modules-Final Module Assembly

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC-A-610FC: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies

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J-STD-001FS WAM 1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical...

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IPC-HDBK-001F: Handbook and Guide to Supplement J-STD-001

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IPC-4562A-WAM1: Metal Foil for Printed Board Applications

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IPC-4556 AM1: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendement 1