Standards: Electronics Assembly: Solderability

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J-STD-001E: Requirements for Soldered Electrical and Electronic Assemblies

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J-STD-004B-CN: 修订本 1 助焊剂要求

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T-50H-CN: 电子电路互连与封装术语及定义

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J-STD-002C-CN WAM1: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment...

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IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components

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J-004A-CN: SUPERSEDED BY J-STD-004B-CN

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4562A-CN: 印制板用金属箔

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J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies

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J-STD-004A-JP: Requirements for Soldering Fluxes

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J-STD-001D-JP: Requirements for Soldered Electrical and Electronic Assemblies

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7095B(D)1: Design and Assembly Process Implementation for BGAs

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J-STD-001D-IT: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-HDBK-005: Guide to Solder Paste Assessment

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J-STD-001D-SW: Requirements for Soldered Electrical and Electronic Assemblies

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J-STD-001D-PL: Wymagania dla lutowanych zespołów elektrycznych i elektronicznych

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J-STD-001D-SP: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-TR-464-AM1: Accelerated Aging for Solderability Evaluations-Addendum

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J-STD-001D: Rev D superseded by Rev E

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J-004A: SUPERSEDED BY J-STD-004B