Standards: Electronics Assembly: Solderability

64 Products

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IPC-4562A-WAM1: Metal Foil for Printed Board Applications

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IPC-4556 AM1: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendement 1

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IPC-AJ-820A: Assembly & Joining Handbook

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IPC-HDBK-001E: Superseded by HDBK-001F: Handbook and Guide to Supplement J-STD-001

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IPC-7094: Design and Assembly Process Implementation for Flip Chip and Die Size Components

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J-STD-004B w/Amend 1: Requirements for Soldering Fluxes - includes Amendment 1

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7095B(D)1: Design and Assembly Process Implementation for BGAs

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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC-AJ-820A: Assembly & Joining Handbook

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Nonmember: $176.00

IPC-A-610FC: Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies

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J-STD-001FS-WAM1: Space Applications Electronic Hardware Addendum to IPC J-STD-001F Requirements for Soldered Electrical and Electronic...

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IPC-HDBK-001F: Handbook and Guide to Supplement J-STD-001

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Nonmember: $138.00

IPC-4562A-WAM1: Metal Foil for Printed Board Applications

Member: $68.00

Nonmember: $135.00

J-STD-001FS: Space Applications Electronic Hardware Addendum to J-STD-001F

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J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-7095C: Design and Assembly Process Implementation for BGAs