JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

IPC-9701A: Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments

IPC-9591: Performance Parameters (Mechanical, Electrical, Environmental and Quality/Reliability) for Air Moving Devices

IPC-4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

IPC-4761: Design Guide for Protection of Printed Board Via Structures