J-STD-006C-AM1: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...
IPC-J-STD-001G: Các Yêu Cầu Cho Các Sản Phẩm Điện và Điện Tử Hàn Lắp Ráp
EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English
EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...
IPC-J-STD-001G-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline - English
IPC-A-610G-RL: Acceptability of Electronic Assemblies-Redline
IPC-2226A: Sectional Design Standard for High Density Interconnect (HDI) Printed Boards
IPC-1072AM1: Intellectual Property Protection in Electronic Assembly Manufacturing
IPC-4550-FAM: Plating Specifications
IPC-6010-FAM: Printed Board Performance Specifications
7090-FAM: Packages for PCBs and Assemblies
CoatBdsAssyFAM: Coating Specifications for Boards and Assemblies
PtdEleFAM: Printed Electronics Family
SolMatFAM: Solder Materials Family
IPC-2316: Design Guide for Embedded Passive Device Printed Boards
IPC-1755 WAM1-2: IPC-1755 WAM1&2 Conflict Minerals Data Exchange Standard