218 Products

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IPC-7095D-WAM1: Design and Assembly Process Implementation for BGAs, with Amendment 1

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IPC-7095D-WAM1: Design and Assembly Process Implementation for BGAs, with Amendment 1

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IPC-2231: DFX Guidelines

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IPC-2231: DFX Guidelines

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IPC-1754-WAM1: Materials and Substances Declaration for Aerospace and Defense and Other Industries

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IPC-1754-WAM1: Materials and Substances Declaration for Aerospace and Defense and Other Industries

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IPC-1791-Amendment 1: Trusted Electronic Designer, Fabricator and Assembler Requirements, Amendment 1

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IPC-J-STD-001G-AM1: J-STD-001G-AM1-FR / Les exigences relatives au brasage d’assemblages électroniques et électriques.

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IPC/JEDEC-9301: Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability

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IPC-7711/21C: Reprise, Modification et Réparation des Assemblages Électroniques

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IPC-7711/21C-French: Reprise, Modification et Réparation des Assemblages Électroniques

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IPC-A-610G: Acceptabilité des Assemblages Électroniques

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IPC-A-610G:Acceptabilité des Assemblages Électroniques

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IPC-J-STD-001G-AM1: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-1791: Trusted Electronic Designer, Fabricator and Assembler Requirement

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IPC-1791: Trusted Electronic Designer, Fabricator and Assembler Requirements

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Annexe des produits électroniques des applications spatiales et militaires à la norme J-STD-001G, Exigences des...

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IPC-J-STD-001G: Les exigences relatives au brasage d’assemblages électroniques et électriques

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IPC-J-STD-001G: Les exigences relatives au brasage d’assemblages électroniques et électriques

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IPC-A-610E-RL: Acceptability of Electronic Assemblies

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IPC-A-610DC-Telecom Addendum

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IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

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IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014

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IPC-J-STD-001E-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline