IPC-7095D-WAM1: Design and Assembly Process Implementation for BGAs, with Amendment 1

IPC-2231: DFX Guidelines

IPC-1754-WAM1: Materials and Substances Declaration for Aerospace and Defense and Other Industries

IPC-1791-Amendment 1: Trusted Electronic Designer, Fabricator and Assembler Requirements, Amendment 1

IPC/JEDEC-9301: Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability

IPC-6903A: 印刷电子设计与生产的术语及定义

IPC-1791: Trusted Electronic Designer, Fabricator and Assembler Requirements

IPC-2292: Design Standard for Printed Electronics on Flexible Substrates

IPC-6903A: Terms and Definitions for the Design and Manufacture of Printed Electronics - English

IPC-2224: Sectional Standard of Design of PWBs for PC Cards - English

IPC-7091: Design and Assembly Process Implementation of 3D Components

J-STD-033C-HU: A nedvességre/újraömlesztésre érzékeny felületszerelt alkatrészek kezelése, csomagolása, szállítása és használata

4562A-CN: 印制板用金属箔

IPC/JEDEC-J-STD-033C-CN: 潮湿/再流焊敏感表面贴装器件的操作、包装、运输及使用

IPC-6018B-CN: 高频（微波）印制板的鉴定及性能规范

T-50M-CN(D)1: 电子电路互连与封装术语及定义

T-50H-CN: 电子电路互连与封装术语及定义

2221A-CH: Generic Standard on Printed Board Design

IPC-T-50M-FR: Termes et Définitions pour les Circuits Électroniques Imprimés et Assemblés

IPC-2221B-FR: Norme Générique de Conception du Circuit imprimé

IPC-2222A-FR: Norme Sectionnelle de Conception pour les Circuits Imprimés Organiques Rigides

7351B-DE: Basisanforderungen an das SMT-Design und SMD-Anschlussflächen-Richtlinie

IPC-2221A-DE: SUPERSEDED BY IPC-2221B-DE

IPC-2223A-DE: Sectional Design Standard for Flexible Printed Boards