IPC-1791A: Trusted Electronic Designer, Fabricator and Assembler Requirements

IPC-2223E: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

IPC-7095D-WAM1: Design and Assembly Process Implementation for BGAs, with Amendment 1

IPC-2231: 卓越设计（DFX）指南

IPC-2231: DFX Guidelines

IPC-1754-WAM1: Materials and Substances Declaration for Aerospace and Defense and Other Industries

IPC-1791-Amendment 1: Trusted Electronic Designer, Fabricator and Assembler Requirements, Amendment 1

IPC/JEDEC-9301: Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability

IPC-1791: Trusted Electronic Designer, Fabricator and Assembler Requirements

IPC-2292: Design Standard for Printed Electronics on Flexible Substrates

IPC-2224: Sectional Standard of Design of PWBs for PC Cards - English

IPC-6903A: Terms and Definitions for the Design and Manufacture of Printed Electronics - English

IPC-6903A: 印刷电子设计与生产的术语及定义

IPC-7091: Design and Assembly Process Implementation of 3D Components

IPC-2581B-WAM1: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

IPC-2223D: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

T-50M-CN(D)1: 电子电路互连与封装术语及定义

IPC-9691B: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other...

IPC-D-640: Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring

IPC-T-50M-FR: Termes et Définitions pour les Circuits Électroniques Imprimés et Assemblés

IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

IPC-7092: Design and Assembly Process Implementation for Embedded Components

IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices