Standards: Other Standards: Design

27 Products

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IPC-1791A: Trusted Electronic Designer, Fabricator and Assembler Requirements

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IPC-7351B: 表面贴装设计及连接盘图形标准通用要求

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IPC-2223E: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

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IPC-1791-AM1: Trusted Electronic Designer, Fabricator and Assembler Requirements, Amendment 1

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IPC-7095D-WAM1: Design and Assembly Process Implementation for BGAs, with Amendment 1

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IPC-2231: DFX Guidelines

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IPC-1754-WAM1: Materials and Substances Declaration for Aerospace and Defense and Other Industries

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IPC-6903A: 印刷电子设计与生产的术语及定义

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IPC-1791: Trusted Electronic Designer, Fabricator and Assembler Requirement

Member: $72.00

Nonmember: $144.00

IPC-1754: Material Declaration Standard for Aerospace and Defense

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Nonmember: $100.00

IPC-6903A: Terms and Definitions for the Design and Manufacture of Printed Electronics

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IPC-7091: Design and Assembly Process Implementation of 3D Components

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IPC-2226A: Sectional Design Standard for High Density Interconnect (HDI) Printed Boards

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7090-FAM: Packages for PCBs and Assemblies

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PtdEleFAM: Printed Electronics Family

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IPC-2220-FAM: Design Standards for Printed Boards

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IPC-2291: Design Guideline for Printed Electronics

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IPC-2223D: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

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IPC-9691B: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other...

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IPC-D-640: Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring

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T-50M-CN: 电子电路互连与封装术语及定义

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IPC-T-50M-FR: Termes et Définitions pour les Circuits Électroniques Imprimés et Assemblés

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IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

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IPC-7092: Design and Assembly Process Implementation for Embedded Components