Standards: Other Standards: Design

120 Products

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IPC-1754-WAM1: Materials and Substances Declaration for Aerospace and Defense and Other Industries

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IPC-1791-Amendment 1: Trusted Electronic Designer, Fabricator and Assembler Requirements, Amendment 1

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IPC/JEDEC-9301: Numerical Analysis Guidelines for Microelectronics Packaging Design and Reliability

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IPC-6903A: 印刷电子设计与生产的术语及定义

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IPC-1791: Trusted Electronic Designer, Fabricator and Assembler Requirement

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IPC-1791: Trusted Electronic Designer, Fabricator and Assembler Requirements

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IPC-1754: Material Declaration Standard for Aerospace and Defense

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IPC-2292: Design Standard for Printed Electronics on Flexible Substrates

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IPC-6903A: Terms and Definitions for the Design and Manufacture of Printed Electronics

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IPC-6903A: Terms and Definitions for the Design and Manufacture of Printed Electronics - English

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IPC-6903A: 印刷电子设计与生产的术语及定义

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IPC-2226A: Sectional Design Standard for High Density Interconnect (HDI) Printed Boards

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IPC-7091: Design and Assembly Process Implementation of 3D Components

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IPC-7091: Design and Assembly Process Implementation of 3D Components

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7090-FAM: Packages for PCBs and Assemblies

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PtdEleFAM: Printed Electronics Family

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IPC-2581B-WAM1: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

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IPC-2223D: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

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IPC-2223D: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

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T-50M-CN(D)1: 电子电路互连与封装术语及定义

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T-50M-CN: 电子电路互连与封装术语及定义

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IPC-9691B: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other...

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IPC-9691B: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other...

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IPC-D-640: Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring