Standards: Other Standards: Design

105 Products

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7090-FAM: Packages for PCBs and Assemblies

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PtdEleFAM: Printed Electronics Family

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IPC-2220-FAM: Design Standards for Printed Boards

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J-STD-033C-HU: A nedvességre/újraömlesztésre érzékeny felületszerelt alkatrészek kezelése, csomagolása, szállítása és használata

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4562A-CN: 印制板用金属箔

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IPC/JEDEC-J-STD-033C-CN: 潮湿/再流焊敏感表面贴装器件的操作、包装、运输及使用

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IPC-6018B-CN: 高频(微波)印制板的鉴定及性能规范

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T-50M-CN(D)1: 电子电路互连与封装术语及定义

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T-50H-CN: 电子电路互连与封装术语及定义

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2221A-CH: Generic Standard on Printed Board Design

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IPC-T-50M-FR: Termes et Définitions pour les Circuits Électroniques Imprimés et Assemblés

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IPC-2221B-FR: Norme Générique de Conception du Circuit imprimé

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IPC-2222A-FR: Norme Sectionnelle de Conception pour les Circuits Imprimés Organiques Rigides

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7351B-DE: Basisanforderungen an das SMT-Design und SMD-Anschlussflächen-Richtlinie

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IPC-2221A-DE: SUPERSEDED BY IPC-2221B-DE

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IPC-2223A-DE: Sectional Design Standard for Flexible Printed Boards

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7351A-DE: SUPERSEDED BY 7351B-DE

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IPC-7525B-DE: Designrichtlinie für Druckschablonen

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IPC/JEDEC-J-STD-033C-DE: Handhabung, Verpackung, Transport und Einsatz feuchtigkeits-/reflow- und/oder prozessempfindlicher Bauteile

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D-859: Design Standard for Thick Film Multilayer Hybrid Circuits

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D-390A: Automated Design Guidelines

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D-322: Guidelines for Selecting Printed Wiring Board Sizes Using Standard Panel Sizes

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D-310C: Guidelines for Phototool Generation and Measurement Techniques

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IPC-J-STD-027: Mechanical Outline Standard for Flip Chip and Chip Size Configurations