Standards: Other Standards: Design

115 Products

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IPC-7092: Design and Assembly Process Implementation for Embedded Components

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IPC-7092: Design and Assembly Process Implementation for Embedded Components

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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

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J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

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IPC-HDBK-630: Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures

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IPC-2291: Design Guideline for Printed Electronics

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IPC-2291: Design Guideline for Printed Electronics

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IPC-T-50K: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC-2220-FAM: Design Standards for Printed Boards

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IPC-2221B-FR: Norme Générique de Conception du Circuit imprimé

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IPC-2221B: Generic Standard on Printed Board Design

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IPC/JPCA-4921: Requirements for Printed Electronics Base Materials (Substrates)

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J-STD-033C-HU: A nedvességre/újraömlesztésre érzékeny felületszerelt alkatrészek kezelése, csomagolása, szállítása és használata

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IPC/JEDEC-J-STD-033C-CN: 潮湿/再流焊敏感表面贴装器件的操作、包装、运输及使用

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IPC/JEDEC-J-STD-033C-DE: Handhabung, Verpackung, Transport und Einsatz feuchtigkeits-/reflow- und/oder prozessempfindlicher Bauteile

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IPC-6018B-CN: 高频(微波)印制板的鉴定及性能规范

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IPC-7525B-DE: Designrichtlinie für Druckschablonen

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IPC-7525B: Stencil Design Guidelines

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IPC-T-50J: SUPERSEDED BY T-50K

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ASSEMBLYISSUE-03-11: HDI Assembly Related Issues

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IPC-2222A-FR: Norme Sectionnelle de Conception pour les Circuits Imprimés Organiques Rigides

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IPC-2222A: Sectional Design Standard for Rigid Organic Printed Boards