Standards: Other Standards: Design

105 Products

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IPC-2141A: Design Guide for High-Speed Controlled Impedance Circuit Boards

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1756: Manufacturing Process Data Management

Member: $41.00

Nonmember: $83.00

1751A: Generic Requirements for Declaration Process Management - includes Amendment 1

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IPC-2222A: Sectional Design Standard for Rigid Organic Printed Boards

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IPC-2291: Design Guideline for Printed Electronics

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IPC-T-50K: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

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J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

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IPC-HDBK-630: Guidelines for Design, Manufacture, Inspection and Testing of Electronic Enclosures

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC-2581B-WAM1: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

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IPC-D-640: Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring

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IPC-2223D: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

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IPC-9691B: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other...

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IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

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IPC-7092: Design and Assembly Process Implementation for Embedded Components

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IPC-4781: Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Ink

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IPC-4811: Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards

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IPC/JPCA-4921: Requirements for Printed Electronics Base Materials (Substrates)

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IPC-T-50J: SUPERSEDED BY T-50K

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IPC-7525B: Stencil Design Guidelines

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ASSEMBLYISSUE-03-11: HDI Assembly Related Issues

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IPC-2291: Design Guideline for Printed Electronics

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Nonmember: $176.00

IPC-2223D: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards