Standards: Other Standards: Lead Free

50 Products

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IPC-J-STD-001G-AM1: Enthält Anforderungen für Lötmaterialien und -prozesse für elektronische Baugruppen.

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IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC-J-STD-002E: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC-J-STD-001G: Enthält Anforderungen für Lötmaterialien und -prozesse für elektronische Baugruppen

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IPC-J-STD-001G: Enthält Anforderungen für Lötmaterialien und -prozesse für elektronische Baugruppen.

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IPC-A-610G: Anforderungen an gelötete elektrische und elektronische Baugruppen

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IPC-A-610G: Anforderungen an gelötete elektrische und elektronische Baugruppen

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IPC-J-STD-001G: 焊接的电⽓和电⼦组件要求 - Chinese

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IPC-J-STD-001G: 焊接的电⽓和电⼦组件要求

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IPC-A-610G: 电⼦组件的可接受性 -Chinese

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IPC-A-610G: 电⼦组件的可接受性 - Chinese

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...

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IPC-J-STD-001G-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline - English

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IPC-A-610G-RL: Acceptability of Electronic Assemblies-Redline

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IPC-A-610G: Acceptability of Electronic Assemblies

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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-7711/21C-电子组件的返工、修改和维修

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IPC-A-610G: Acceptability of Electronic Assemblies

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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-4550-FAM: Plating Specifications

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IPC-6010-FAM: Printed Board Performance Specifications

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7090-FAM: Packages for PCBs and Assemblies

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BdMatFAM: Base Material Specifications for Printed Boards