Standards: Other Standards: Lead Free

12 Products

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IPC-A-610GC: Telecom Addendum to IPC-A-610 Revision G Acceptability of Electronic Assemblies

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IPC-1754-WAM1: Materials and Substances Declaration for Aerospace and Defense and Other Industries

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IPC-1754-WAM1: Materials and Substances Declaration for Aerospace and Defense and Other Industries

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IPC-7095C-CN: BGA设计与组装工艺的实施

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J-STD-006C-CN: 电子焊接领域电子级焊料合金及含助焊剂与不含助焊剂的固体焊料的要求

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IPC-A-610D WAM1: Acceptability of Electronic Assemblies

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IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

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IPC/JEDEC/ECA-J-STD-002D: EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

Member: $88.00

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IPC-7095C: Design and Assembly Process Implementation for BGAs