Standards: Other Standards: Lead Free

18 Products

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IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

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J-STD-006C-CN: 电子焊接领域电子级焊料合金及含助焊剂与不含助焊剂的固体焊料的要求

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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

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IPC-J-STD-006C: 電子グレードはんだ合金、および電子はんだ付用やに入り/やになし固体はんだに関する要求事項

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IPC/JEDEC/ECA-J-STD-002D: EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires

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IPC-7095C-CN: BGA设计与组装工艺的实施

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC/WHMA-A-620A-DE: Rev A superseded by Rev B

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IPC-A-610D-CZ: Acceptability of Electronic Assemblies

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J-STD-001D-DE: Requirements for Soldered Electrical and Electronic Assemblies

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J-STD-001D-JP: Requirements for Soldered Electrical and Electronic Assemblies

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IPC/JEDEC-J-STD-020D-DE: IPC/JEDEC Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

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A-610DJP(D)1: Acceptability of Electronic Assemblies

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IPC-7711/21B-HU: Elektronikai szerelvények újramunkálása, módosítása és javítása

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IPC-7711/21B-CZ: Přepracování, modifikace a opravy elektronických sestav

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IPC-7711/21B-CN: 电子组件的返工、修改和维修