Standards: Other Standards: Lead Free

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J-STD-001F-AM1-FR: Exigences des Assemblages Électriques et Électroniques Brasés

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IPC-A-610F-AM1-FR: Acceptabilité des Assemblages Électroniques

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J-STD-001F-AM1-RO: Cerințe pentru Ansamblurile Electrice și Electronice Lipite

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IPC-A-610F AM1-CN: 电子组件的可接受性 修订本1

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IPC-A-610F-SE: Acceptanskrav för kretskort

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J-STD-001F AM1: Requirements for Soldered Electrical and Electronic Assemblies - Amendment 1

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IPC/JEDEC/ECA-J-STD-002D-CN: 元器件引线、焊端、焊片、端子和导线的可焊性测试

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IPC/JEDEC-J-STD-020E-CN: 非气密表面贴装器件潮湿/再流焊敏感度分级

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IPC-6012D-FR: Spécification de la Qualification et des Performances des Circuits Imprimés Rigides

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IPC-6012DS-DE: Ergänzung zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten für Raumfahrt-Anwendungen

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IPC-6012DS-DE: Ergänzung zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten für Raumfahrt-Anwendungen

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IPC-T-50M-FR: Termes et Définitions pour les Circuits Électroniques Imprimés et Assemblés

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IPC-T-50M-FR: Termes et Définitions pour les Circuits Électroniques Imprimés et Assemblés

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IPC-1755 Amendment 1: Conflict Minerals Data Exchange Standard Amendment 1

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IPC-7801: Reflow Oven Process Control Standard

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IPC-7801: 再流焊炉工艺控制标准 - Chinese

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IPC/JEDEC-J-STD-020E: Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices

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J-STD-001FS-SP: Adición de dispositivos electrónicos para aplicaciones espaciales del IPC J-STD-001F Requisitos Para Uniones Eléctricas...

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J-STD-004B-CN: 修订本 1 助焊剂要求

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IPC-J-STD-006C-Japanese: 電子グレードはんだ合金、および電子はんだ付用やに入り/やになし固体はんだに関する要求事項

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IPC-J-STD-006B-AM1 & 2: Requirements for Electronic Grade Solder alloys and Fluxed and Non-Fluxed Solid Solders...

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IPC-J-STD-001DS: Space Applications Electronic Hardware Addendum to J-STD-001D Requirements for Soldered Electrical and Electronic Assemblies

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IPC-A-610DC-Telecom Addendum

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IPC/WHMA-A-620A-PL: Rev A superseded by Rev B