IPC-J-STD-006C: 電子グレードはんだ合金、および電子はんだ付用やに入り/やになし固体はんだに関する要求事項
Standards: Other Standards: Lead Free
9 Products
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IPC-7095C-CN: BGA设计与组装工艺的实施
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J-STD-006C-CN: 电子焊接领域电子级焊料合金及含助焊剂与不含助焊剂的固体焊料的要求
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IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
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J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...
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IPC/JEDEC/ECA-J-STD-002D: EIA/IPC/JEDEC J-STD-002D Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
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IPC-7095C: Design and Assembly Process Implementation for BGAs
Member: $49.00 Nonmember: $98.00
J-STD-006C: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...
Member: $88.00 Nonmember: $176.00
IPC-7095C: Design and Assembly Process Implementation for BGAs