IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

J-STD-003C WAM1: Solderability Tests for Printed Boards

IPC-A-610F-VN: Yêu Cầu Chấp Nhận Cho Các Lắp Ráp Điện Tử

IPC-A-610F-DK: Godkendelseskrav for elektronikprodukter

IPC-A-610F-FR: Acceptabilité des assemblages électroniques

IPC-A-610F-DE: Abnahmekriterien für elektronische Baugruppen

IPC-A-610F: Acceptability of Electronic Assemblies

J-STD-001F: Requirements for Soldered Electrical and Electronic Assemblies

IPC-A-610F-SP: Aceptabilidad de Ensambles Electrónicos

J-STD-033C-1: Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices

IPC-A-610F: มาตรฐานการยอมรับของงานประกอบอิเล็กทรอนิกส์

J-STD-001F-TR: Lehimli Elektrikli ve Elektronik Takımların Gereklilikleri

IPC-A-610F-NL: Acceptatie van geassembleerde printplaten

J-STD-001F-KR: 솔더링된 전기 및 전자 어셈블리에 대한 요건들

IPC-A-610F-KR: 전자 어셈블리에 대한 허용 가능성

J-STD-001F-PL: Wymagania dla lutowanych zespołów elektrycznych i elektronicznych

IPC-A-610F-PL: Dopuszczalność Zespołów Elektronicznych

J-STD-001F-JP: はんだ付される電気及び電子組立品に関する要件事項

IPC-A-610F-IT: IPC-A-610F Accettabilità degli Assemblaggi Elettronici

J-STD-001F-DK: Krav til loddede elektriske og elektroniske produkter

IPC-4101D-WAM1: Specification for Base Materials for Rigid and Multilayer Printed Boards

J-STD-003C-CN-WAM1: 印制板可焊性测试

1752A-WAM1-2: Materials Declaration Management with Amendments 1 & 2

IPC-J-STD-002D-Errata: J-STD-002D Errata Information March 2014