Standards: Other Standards: Lead Free

46 Products

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IPC-7535: Requirements for Solder Dross Reduction Chemicals 锡渣抗氧化还原剂要求

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IPC-7535: Requirements for Solder Dross Reduction Chemicals 锡渣抗氧化还原剂要求

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IPC-9262: Specification for Characterization and Verification of Assembly Level Automatic Optical Inspection Equipment 组装行业应用之AOI设备的特性描述与鉴定

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IPC-9241: Guidelines for Microsection Preparation

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IPC-9262: Specification for Characterization and Verification of Assembly Level Automatic Optical Inspection Equipment 组装行业应用之AOI设备的特性描述与鉴定

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IPC-9241: Guidelines for Microsection Preparation

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IPC-A-610F-AM1: Acceptabilitatea Ansamblurilor Electronice Amendament 1

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J-STD-001FS-CN: 焊接的电气和电子组件要求航天应用电子部件补充标准

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J-STD-001FS-CN: 焊接的电气和电子组件要求航天应用电子部件补充标准

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IPC-A-610F-IT-WAM1: Accettabilità degli Assemblaggi Elettronici

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IPC-6012DS-FR: Avenant pour les Applications Spatiales et Aéronautiques Militaires de l’IPC-6012D, Spécification de la Qualification...

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IPC-6012DS-FR: Avenant pour les Applications Spatiales et Aéronautiques Militaires de l’IPC-6012D, Spécification de la Qualification...

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IPC-7530-CN: 群焊工艺温度曲线指南(再流焊和波峰焊)

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IPC-7530-CN: 群焊工艺温度曲线指南(再流焊和波峰焊)

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J-STD-001F-WAM1-CN: 焊接的电气和电子组件要求修订版F附修订本1

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J-STD-001F-WAM1-CN: 焊接的电气和电子组件要求修订版F附修订本1

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IPC-6012DA-DE: Ergänzung für Anwendungen der Automobilbranche zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten

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IPC-6012DA-DE: Ergänzung für Anwendungen der Automobilbranche zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten

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IPC-4562A-WAM1: Metal Foil for Printed Board Applications

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IPC-4556 AM1: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendement 1

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IPC-4562A-WAM1: Metal Foil for Printed Board Applications

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IPC-SM-817A: General Requirements for Dielectric Surface Mount Adhesives

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J-STD-003C WAM1: Solderability Tests for Printed Boards

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IPC-A-610F-VN: Yêu Cầu Chấp Nhận Cho Các Lắp Ráp Điện Tử