Standards: Other Standards: Lead Free

38 Products

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IPC-A-610GC: Telecom Addendum to IPC-A-610 Revision G Acceptability of Electronic Assemblies

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J-STD-006C-AM1: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic...

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IPC-1754-WAM1: Materials and Substances Declaration for Aerospace and Defense and Other Industries

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IPC-1754-WAM1: Materials and Substances Declaration for Aerospace and Defense and Other Industries

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IPC-A-610G: Acceptabilitatea Ansamblurilor Electronice

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IPC-A-610G: Acceptabilitatea Ansamblurilor Electronice

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English

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EIA/IPC/JEDEC J-STD-002E: Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - English [DRM...

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IPC-J-STD-001G-RL: Requirements for Soldered Electrical and Electronic Assemblies - Redline - English

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IPC-A-610G-RL: Acceptability of Electronic Assemblies-Redline

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IPC-A-610G: Acceptability of Electronic Assemblies

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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-A-610G: Acceptability of Electronic Assemblies

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J-STD-001G: Requirements for Soldered Electrical and Electronic Assemblies

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IPC-4550-FAM: Plating Specifications

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IPC-6010-FAM: Printed Board Performance Specifications

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7090-FAM: Packages for PCBs and Assemblies

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CoatBdsAssyFAM: Coating Specifications for Boards and Assemblies

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PtdEleFAM: Printed Electronics Family

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SolMatFAM: Solder Materials Family

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IPC-1755 WAM1-2: IPC-1755 WAM1&2 Conflict Minerals Data Exchange Standard

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IPC-7530A: Guidelines for Temperature Profiling for Mass Soldering (Reflow & Wave) Processes

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IPC/WHMA-A-620C REDLINE: Requirements and Acceptance for Cable and Wire Harness Assemblies

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IPC-9204: Guideline on Flexibility and Stretchability Testing for Printed Electronics