47 Products

Member: $92.00

Nonmember: $184.00

IPC-6012E: Qualification and Performance Specification for Rigid Printed Boards

Member: $76.00

Nonmember: $152.00

IPC-1791A: Trusted Electronic Designer, Fabricator and Assembler Requirements

Member: $88.00

Nonmember: $176.00

IPC-2223E: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards

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Nonmember: $176.00

IPC-2591-Version 1.1: Connected Factory Exchange (CFX)

Member: $27.00

Nonmember: $53.00

IPC-9121-AM2: Troubleshooting for Printed Board Fabrication Processes, Amendment 2

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Nonmember: $30.00

IPC-4556-AM1: is a Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendment...

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IPC-6013D-AM1: Qualification and Performance Specification for Flexible and Rigid-Flexible Printed Boards

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IPC-1791-AM1: Trusted Electronic Designer, Fabricator and Assembler Requirements, Amendment 1

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Nonmember: $58.00

IPC-9121-AM1: Troubleshooting for PCB Fabrication Processes, Amendment 1

Member: $15.00

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IPC-4412B-AM2: Specification for Finished Fabric Woven from “E” Glass for Printed Boards

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IPC-6012D-AM1: Qualification and Performance Specification for Rigid Printed Boards

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IPC-2591: Intercambio en fábricas conectadas (CFX)

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IPC-HERMES-9852: The Global Standard for Machine-to-Machine Communication in SMT Assembly

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IPC-2591: Connected Factory Exchange (CFX)

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IPC-6012DA-WAM1: Automotive Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards

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IPC-4204B: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

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IPC-1791: Trusted Electronic Designer, Fabricator and Assembler Requirement

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IPC-1601A: Guía para el manejo y almacenamiento de tarjetas impresas

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IPC-1752A WAM1,2 & 3: Materials Declaration Management Standard

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IPC-4591A: Requirements for Printed Electronics Functional Conductive Materials

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IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications

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IPC-J-STD-003C-WAM1: Solderability Tests for Printed Boards

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IPC-7091: Design and Assembly Process Implementation of 3D Components

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IPC-2226A: Sectional Design Standard for High Density Interconnect (HDI) Printed Boards