IPC-2222B-English: Sectional Design Standard for Rigid Organic Printed Boards
Standards: PCB Fabrication: Acceptance
73 Products
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IPC-A-600K: Abnahmekriterien für Leiterplatten
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IPC-A-600K: 印制板的可接受性
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IPC-A-600K: Acceptability of Printed Boards
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IPC-1791A: Trusted Electronic Designer, Fabricator and Assembler Requirements
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IPC-1791-Amendment 1: Trusted Electronic Designer, Fabricator and Assembler Requirements, Amendment 1
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IPC-1791: Trusted Electronic Designer, Fabricator and Assembler Requirements
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IPC-4412B-AM2: Specification for finished Fabric Woven from "E" Glass for Printed Boards
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Qualification and Performance Specification for Flexible and Rigid-Flexible Printed Boards
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IPC-6013D: Specyfikacja Zdolności i Osiągów dla Elastycznych / Sztywno-Elastycznych Płyt Drukowanych
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IPC-J-STD-003C-WAM1&2: Solderability Tests for Printed Boards - English
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IPC-4101E: Specification for Base Materials for Rigid and Multilayer Printed Boards
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IPC-4202B: 挠性印制板用挠性基底电介质
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IPC-2581B-WAM1: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
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IPC-9241: Guidelines for Microsection Preparation
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IPC-6012D-SP: Clasificación y especificación de rendimiento para los tableros impresos rígidos
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IPC-9252B: Requirements for Electrical Testing of Unpopulated Printed Boards
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IPC-6018CS: Space and Military Avionics Applications Addendum to IPC-6018C Qualification and Performance Specification for High...
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IPC-6018C: Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
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IPC-9691B: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other...
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IPC-6012DS-FR: Avenant pour les Applications Spatiales et Aéronautiques Militaires de l’IPC-6012D, Spécification de la Qualification...
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IPC-9691B: IPC-TM-650 测试方法2.6.25耐导电阳极丝（CAF）及其他内部电化学迁移（ECM）测试用户指南
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IPC-A-600J: การยอมรับของบอร์ดพิมพ์
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IPC-A-600J: 印製板的可接受性