Standards: PCB Fabrication: Acceptance

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IPC-2222B-English: Sectional Design Standard for Rigid Organic Printed Boards

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IPC-A-600K: 印制板的可接受性

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IPC-A-600K: Acceptability of Printed Boards - Multi Device License

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IPC-A-600K: Acceptability of Printed Boards

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IPC-1791A: Trusted Electronic Designer, Fabricator and Assembler Requirements

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IPC-1791-Amendment 1: Trusted Electronic Designer, Fabricator and Assembler Requirements, Amendment 1

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IPC-1791: Trusted Electronic Designer, Fabricator and Assembler Requirements

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IPC-4412B-AM2: Specification for finished Fabric Woven from "E" Glass for Printed Boards

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Qualification and Performance Specification for Flexible and Rigid-Flexible Printed Boards

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IPC-6013D: Specyfikacja Zdolności i Osiągów dla Elastycznych / Sztywno-Elastycznych Płyt Drukowanych

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IPC-J-STD-003C-WAM1&2: Solderability Tests for Printed Boards - English

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IPC-4101E: Specification for Base Materials for Rigid and Multilayer Printed Boards

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IPC-4550-FAM: Plating Specifications

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IPC-6010-FAM: Printed Board Performance Specifications

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CoatBdsAssyFAM: Coating Specifications for Boards and Assemblies

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SolMatFAM: Solder Materials Family

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IPC-4202B: 挠性印制板用挠性基底电介质

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IPC-2581B-WAM1: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

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IPC-9241: Guidelines for Microsection Preparation

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IPC-6012D-SP: Clasificación y especificación de rendimiento para los tableros impresos rígidos

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IPC-9252B: Requirements for Electrical Testing of Unpopulated Printed Boards

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IPC-6018CS: Space and Military Avionics Applications Addendum to IPC-6018C Qualification and Performance Specification for High...

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IPC-6018C: Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

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IPC-9691B: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other...