IPC-4202B: 挠性印制板用挠性基底电介质
Standards: PCB Fabrication: Acceptance
24 Products
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IPC-2581B-WAM1: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
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IPC-9241: Guidelines for Microsection Preparation
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IPC-6012D-SP: Clasificación y especificación de rendimiento para los tableros impresos rígidos
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IPC-9252B: Requirements for Electrical Testing of Unpopulated Printed Boards
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IPC-6018CS: Space and Military Avionics Applications Addendum to IPC-6018C Qualification and Performance Specification for High...
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IPC-6018C: Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
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IPC-9691B: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other...
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IPC-6012DS-FR: Avenant pour les Applications Spatiales et Aéronautiques Militaires de l’IPC-6012D, Spécification de la Qualification...
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IPC-9691B: IPC-TM-650 测试方法2.6.25耐导电阳极丝（CAF）及其他内部电化学迁移（ECM）测试用户指南
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IPC-A-600J: การยอมรับของบอร์ดพิมพ์
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IPC-A-600J: Acceptability of Printed Boards
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IPC-A-600J: 印製板的可接受性
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IPC-A-600J: Kryteria Dopuszczenia Płyt Drukowanych
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IPC-A-600J-CN: 印制板的可接受性
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IPC-A-600J-SP: Aceptabilidad de Tableros Impresos
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IPC-A-600J-DE: Abnahmekriterien für Leiterplatten
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IPC-A-600J: Acceptability of Printed Boards
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IPC-6012DA-CN: 刚性印制板的鉴定及性能规范汽车要求附件
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IPC-6012DA-DE: Ergänzung für Anwendungen der Automobilbranche zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten
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IPC-9121: Troubleshooting for PCB Fabrication Processes
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IPC-4562A-WAM1: Metal Foil for Printed Board Applications
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IPC-4556 AM1: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendement 1
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IPC-A-600G-IT/EK: Acceptability of Printed Boards