J-STD-003C WAM1: Solderability Tests for Printed Boards
Standards: PCB Fabrication: Acceptance
11 Products
IPC-4101D-WAM1: Specification for Base Materials for Rigid and Multilayer Printed Boards
J-STD-003C-CN-WAM1: 印制板可焊性测试
IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1
IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards
IPC-4203A: Cover and Bonding Material for Flexible Printed Circuitry
IPC-9592B: Requirements for Power Conversion Devices for the Computer and Telecommunications Industries
IPC-4556: 印制板化学镍/钯/浸金(ENEPIG)规范
IPC-TF-870: Qualification and Performance of Polymer Thick Film Printed Boards