Standards: PCB Fabrication: Acceptance

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IPC-6012DS: Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid...

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IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards

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IPC-6012DS: Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid...

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IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards

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IPC-6012D-CN: 刚性印制板的鉴定及性能规范

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IPC-6012DS-SP: Adición de aplicaciones de aviónica militar y espacial del IPC-6012D, Clasificación y especificación de...

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IPC-6012D-FR: Spécification de la Qualification et des Performances des Circuits Imprimés Rigides

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IPC-6012DS-DE: Ergänzung zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten für Raumfahrt-Anwendungen

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IPC-6012C-CN: 刚性印制板的鉴定及性能规范

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IPC-6012D-FR: Spécification de la Qualification et des Performances des Circuits Imprimés Rigides

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IPC-6012DS-DE: Ergänzung zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten für Raumfahrt-Anwendungen

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J-STD-048: Notification Standard for Product Discontinuance

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J-STD-003C WAM1: Solderability Tests for Printed Boards

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IPC-4101D-WAM1: Specification for Base Materials for Rigid and Multilayer Printed Boards

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J-STD-003C-CN-WAM1: 印制板可焊性测试

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IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

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IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry