Standards: PCB Fabrication: Acceptance

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IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards

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IPC-6012DS: Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid...

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IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards

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IPC-6012D-CN: 刚性印制板的鉴定及性能规范

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IPC-6012DS-SP: Adición de aplicaciones de aviónica militar y espacial del IPC-6012D, Clasificación y especificación de...

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IPC-6012D-FR: Spécification de la Qualification et des Performances des Circuits Imprimés Rigides

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IPC-6012DS-DE: Ergänzung zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten für Raumfahrt-Anwendungen

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IPC-6012C-CN: 刚性印制板的鉴定及性能规范

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IPC-6012D-FR: Spécification de la Qualification et des Performances des Circuits Imprimés Rigides

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IPC-6012DS-DE: Ergänzung zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten für Raumfahrt-Anwendungen

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J-STD-048: Notification Standard for Product Discontinuance

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J-STD-003C WAM1: Solderability Tests for Printed Boards

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IPC-4101D-WAM1: Specification for Base Materials for Rigid and Multilayer Printed Boards

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J-STD-003C-CN-WAM1: 印制板可焊性测试

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IPC-J-STD-003C: Solderability Tests for Printed Boards Amendment 1

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IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry

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IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

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IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards

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IPC-4203A: Cover and Bonding Material for Flexible Printed Circuitry

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IPC-9592B: Requirements for Power Conversion Devices for the Computer and Telecommunications Industries

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IPC-4556: 印制板化学镍/钯/浸金(ENEPIG)规范

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IPC-A600H-Errata: IPC-A-600H Errata Information

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IPC-6012D-DE: Qualifikation und Leistungsspezifikation für starre Leiterplatten

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IPC-A-600H-RU: Критерии приемки печатных плат