IPC-7092: 埋入式元器件涉及和组装工艺的实施
Main Category
23 Products
Standards: PCB Fabrication: Embedded
23 Products
IPC-6010-FAM: Printed Board Performance Specifications
7090-FAM: Packages for PCBs and Assemblies
IPC-9691B: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other...
IPC-9691B: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other...
IPC-6012DS-FR: Avenant pour les Applications Spatiales et Aéronautiques Militaires de l’IPC-6012D, Spécification de la Qualification...
IPC-6012DA-CN: 刚性印制板的鉴定及性能规范汽车要求附件
IPC-6012DA-CN: 刚性印制板的鉴定及性能规范汽车要求附件
IPC-4562A-WAM1: Metal Foil for Printed Board Applications
IPC-4562A-WAM1: Metal Foil for Printed Board Applications
J-STD-048: Notification Standard for Product Discontinuance
IPC-7092: Design and Assembly Process Implementation for Embedded Components
IPC-7092: Design and Assembly Process Implementation for Embedded Components
IPC-4101D-WAM1: Specification for Base Materials for Rigid and Multilayer Printed Boards
IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards
IPC-4203A: Cover and Bonding Material for Flexible Printed Circuitry
IPC-6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices
4562A-CN: 印制板用金属箔
IPC-4781: Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Ink
IPC-4811: Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards
IPC-2316: Design Guide for Embedded Passive Device Printed Boards
IPC-4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards