IPC-2223E: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
Standards: PCB Fabrication: Flex
25 Products
IPC-4204B: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards
Qualification and Performance Specification for Flexible and Rigid-Flexible Printed Boards
IPC-6013D: Specyfikacja Zdolności i Osiągów dla Elastycznych / Sztywno-Elastycznych Płyt Drukowanych
IPC-4202B: 挠性印制板用挠性基底电介质
IPC-2223D: Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
IPC-9252B: Requirements for Electrical Testing of Unpopulated Printed Boards
IPC-4556 AM1: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendement 1
IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits
J-STD-048: Notification Standard for Product Discontinuance
IPC-FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards
IPC-4204A WAM1: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Circuitry
IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards
IPC-4203A: Cover and Bonding Material for Flexible Printed Circuitry
IPC-6018B-CN: 高频(微波)印制板的鉴定及性能规范
IPC-SM-840E-CN: 永久性阻焊剂和挠性覆盖材料的鉴定和性能规范
IPC-SM-840E: Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials
T-50H-CN: 电子电路互连与封装术语及定义
IPC-6012B-SW: Qualification and Performance Specification for Rigid Printed Boards
4562A-CN: 印制板用金属箔
IPC-2221A-DE: SUPERSEDED BY IPC-2221B-DE
IPC-2223A-DE: Sectional Design Standard for Flexible Printed Boards
2221A-CH: Generic Standard on Printed Board Design
IPC-DR-572A: Drilling Guidelines for Printed Boards