Standards: PCB Fabrication: HDI

28 Products

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IPC-2226A: Sectional Design Standard for High Density Interconnect (HDI) Printed Boards

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IPC-4550-FAM: Plating Specifications

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IPC-6012D-SP: Clasificación y especificación de rendimiento para los tableros impresos rígidos

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IPC-9252B: Requirements for Electrical Testing of Unpopulated Printed Boards

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IPC-6012D-SP: Clasificación y especificación de rendimiento para los tableros impresos rígidos

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IPC-9252B: Requirements for Electrical Testing of Unpopulated Printed Boards

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IPC-9691B: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other...

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IPC-6012DA: Automotive Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards

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IPC-4562A-WAM1: Metal Foil for Printed Board Applications

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IPC-4556 AM1: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendement 1

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IPC-4562A-WAM1: Metal Foil for Printed Board Applications

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IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards

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IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards

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IPC-6012DS-SP: Adición de aplicaciones de aviónica militar y espacial del IPC-6012D, Clasificación y especificación de...

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IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

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IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

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J-STD-048: Notification Standard for Product Discontinuance

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IPC-4101D-WAM1: Specification for Base Materials for Rigid and Multilayer Printed Boards

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IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC-4781: Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Ink

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IPC-4811: Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards

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IPC-4563: Resin Coated Copper Foil for Printed Boards Guideline