Standards: PCB Fabrication: High-Speed/High-Frequency

32 Products

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IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications

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IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications

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IPC-4550-FAM: Plating Specifications

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4562A-CN: 印制板用金属箔

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IPC-6018B-CN: 高频(微波)印制板的鉴定及性能规范

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T-50H-CN: 电子电路互连与封装术语及定义

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2221A-CH: Generic Standard on Printed Board Design

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IPC-2221A-DE: SUPERSEDED BY IPC-2221B-DE

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IPC-DR-572A: Drilling Guidelines for Printed Boards

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IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

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IPC-2252: Design Guide for RF/Microwave Circuit Boards

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IPC-2251: Design Guide for the Packaging of High Speed Electronic Circuit

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2221A: Generic Standard on Printed Board Design

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IPC-2141A: Design Guide for High-Speed Controlled Impedance Circuit Boards

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IPC-4203A: Cover and Bonding Material for Flexible Printed Circuitry

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IPC-9252B: Requirements for Electrical Testing of Unpopulated Printed Boards

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IPC-9691B: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other...

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IPC-6018CS: Space and Military Avionics Applications Addendum to IPC-6018C Qualification and Performance Specification for High...

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IPC-6018C: Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

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IPC-4562A-WAM1: Metal Foil for Printed Board Applications

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IPC-4556 AM1: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendement 1

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IPC-4103 WAM1 - AM2: Amendment 2 to Specification for Base Materials for High Speed/High Frequency...

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IPC-4101D-WAM1: Specification for Base Materials for Rigid and Multilayer Printed Boards

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J-STD-048: Notification Standard for Product Discontinuance