IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications
Standards: PCB Fabrication: High-Speed/High-Frequency
IPC-9252B: Requirements for Electrical Testing of Unpopulated Printed Boards
IPC-6018CS: Space and Military Avionics Applications Addendum to IPC-6018C Qualification and Performance Specification for High...
IPC-6018C: Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
IPC-9691B: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other...
IPC-4562A-WAM1: Metal Foil for Printed Board Applications
IPC-4556 AM1: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendement 1
IPC-4103 WAM1 - AM2: Amendment 2 to Specification for Base Materials for High Speed/High Frequency...
IPC-4101D-WAM1: Specification for Base Materials for Rigid and Multilayer Printed Boards
IPC-4203A: Cover and Bonding Material for Flexible Printed Circuitry
IPC-2221A-DE: SUPERSEDED BY IPC-2221B-DE
IPC-DR-572A: Drilling Guidelines for Printed Boards
IPC-2141A: Design Guide for High-Speed Controlled Impedance Circuit Boards
IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement
IPC-2251: Design Guide for the Packaging of High Speed Electronic Circuit