Standards: PCB Fabrication: Materials

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IPC-J-STD-004B-WAM1: はんだ付用フラックスに関する要求事項

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IPC-4202B: 挠性印制板用挠性基底电介质

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IPC-1601A: Wytyczne dla obsługiwania i przechowywania płyt drukowanych

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IPC-4921A: 印刷电子基材(基板)要求

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IPC-1601A: 印制板操作和储存指南

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IPC-4101E: 刚性及多层印制板用基材规范

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IPC-4204B: Flexible Metal-Clad Dielectrics for Use in Fabrication of Flexible Printed Boards

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IPC-1601A: Guía para el manejo y almacenamiento de tarjetas impresas

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IPC/JEDEC J-STD-609A Errata Information

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IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium

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IPC-J-STD-004B-AM1: Requirements for Soldering Fluxes

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IPC-4412B-AM2: Specification for finished Fabric Woven from "E" Glass for Printed Boards

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IPC-1753-WAM 1: Laboratory Report Standard - English

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IPC-1752A WAM1,2 & 3: Materials Declaration Management Standard

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IPC-4591A: Requirements for Printed Electronics Functional Conductive Materials

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IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications

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IPC-4552A: Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

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J-STD-004A-JP: Requirements for Soldering Fluxes

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4562A-CN: 印制板用金属箔

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T-50H-CN: 电子电路互连与封装术语及定义

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J-004A-CN: SUPERSEDED BY J-STD-004B-CN

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IPC-1601-CN: 印制板操作和贮存指南

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IPC-1601-DE: Handhabung und Lagerung von Leiterplatten

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QF-143: Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards