Standards: PCB Fabrication: Materials

21 Products

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IPC-4591A: 印刷电子功能导电材料要求

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Nonmember: $137.00

IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications

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Nonmember: $168.00

IPC-4552A: Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

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IPC-4921A: 印刷电子基材(基板)要求

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IPC-4101E: Specification for Base Materials for Rigid and Multilayer Printed Boards - Multi Device License

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IPC-4101E: 刚性及多层印制板用基材规范

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IPC-4101E: 刚性及多层印制板用基材规范

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Nonmember: $130.00

IPC-1755 WAM1-2: IPC-1755 WAM1&2 Conflict Minerals Data Exchange Standard

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Nonmember: $166.00

IPC-4101E: Specification for Base Materials for Rigid and Multilayer Printed Boards

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Nonmember: $148.00

IPC-1755 WAM1-2: IPC-1755 WAM1&2 Conflict Minerals Data Exchange Standard

Member: $87.00

Nonmember: $174.00

IPC-4101E: Specification for Base Materials for Rigid and Multilayer Printed Boards

Member: $297.00

Nonmember: $593.00

IPC-4550-FAM: Plating Specifications

Member: $232.00

Nonmember: $463.00

CoatBdsAssyFAM: Coating Specifications for Boards and Assemblies

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SolMatFAM: Solder Materials Family

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IPC-J-STD-004B-WAM1: はんだ付用フラックスに関する要求事項

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J-004A-CN: SUPERSEDED BY J-STD-004B-CN

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Nonmember: $93.00

4562A-CN: 印制板用金属箔

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IPC-4781: Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Ink

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IPC-4811: Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards

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J-STD-004A-JP: Requirements for Soldering Fluxes

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IPC-4563: Resin Coated Copper Foil for Printed Boards Guideline