Standards: PCB Fabrication: Materials

80 Products

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IPC-4591A: Requirements for Printed Electronics Functional Conductive Materials

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IPC-4591A: Requirements for Printed Electronics Functional Conductive Materials

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IPC-4103B: Specification for Base Materials for High Speed/High Frequency Applications

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IPC-4552A: Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

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IPC-4550-FAM: Plating Specifications

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CoatBdsAssyFAM: Coating Specifications for Boards and Assemblies

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SolMatFAM: Solder Materials Family

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J-STD-004A-JP: Requirements for Soldering Fluxes

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4562A-CN: 印制板用金属箔

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T-50H-CN: 电子电路互连与封装术语及定义

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J-004A-CN: SUPERSEDED BY J-STD-004B-CN

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IPC-1601-CN: 印制板操作和贮存指南

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IPC-1601-DE: Handhabung und Lagerung von Leiterplatten

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QF-143: Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards

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IPC-SG-141: Specification for Finished Fabric Woven from "S" Glass for Printed Boards

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JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

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J-004A: SUPERSEDED BY J-STD-004B

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IPC-CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards

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A-142: Specification for Finished Fabric Woven from Aramid for Printed Boards

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IPC-4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

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IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

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IPC-4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat

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IPC-4121: Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications

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IPC-4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boards