4562A-CN: 印制板用金属箔

IPC-4781: Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Ink

IPC-4811: Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards

J-STD-004A-JP: Requirements for Soldering Fluxes

IPC-4563: Resin Coated Copper Foil for Printed Boards Guideline

IPC-4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

IPC-1731: 1731 - Strategic Raw Materials Supplier Qualification Profile

IPC-4121: Guidelines for Selecting Core Construction for Multilayer Printed Wiring Board Applications

IPC-4130: Specification & Characterization Methods for Nonwoven "E" Glass Mat

IPC-4110: Specification & Characterization Methods for Non Woven Cellulose Based Paper for Printed Boards

IPC-CF-152B: Composite Metallic Materials Specification for Printed Wiring Boards

QF-143: Specifications for Finished Fabric Woven from Quartz (Pure Fused Silica) for Printed Boards

IPC-SG-141: Specification for Finished Fabric Woven from "S" Glass for Printed Boards

A-142: Specification for Finished Fabric Woven from Aramid for Printed Boards

J-004A: SUPERSEDED BY J-STD-004B

4104: Specification for High Density Interconnect (HDI) and Microvia Materials