Standards: PCB Fabrication: Processes/Fabrication

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IPC-2591-Version 1.2: Connected Factory Exchange (CFX)

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IPC-6012EM: Medical Applications Addendum to IPC-6012E Qualification and Performance Specification for Rigid Printed Boards

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IPC-6012ES: Space and Military Avionics Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid...

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IPC-6012E: Qualifikation und Leistungsspezifikation für starre Leiterplatten

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IPC-6012E: 刚性印制板的鉴定及性能规范

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IPC-6012E: Qualification and Performance Specification for Rigid Printed Boards

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IPC-6012DS: Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid...

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IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards

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IPC-6012DS: Dodatek do Aplikacji Kosmicznych i Awioniki Wojskowej dla dokumentu IPC-6012D - Specyfikacji Zdolności i...

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IPC-6012DS: リジッドプリント板の認定および性能仕様宇宙・軍用アビオニクス用途向け追加規格

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IPC-6012C-CN: 刚性印制板的鉴定及性能规范

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IPC-6012D-FR: Spécification de la Qualification et des Performances des Circuits Imprimés Rigides

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IPC-6012DS-DE: Ergänzung zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten für Raumfahrt-Anwendungen

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IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

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IPC-7092: Design and Assembly Process Implementation for Embedded Components