Standards: PCB Fabrication: Processes/Fabrication

16 Products

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IPC-4556: 印制板化学镍/钯/浸金(ENEPIG)规范

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J-STD-004A-JP: Requirements for Soldering Fluxes

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4562A-CN: 印制板用金属箔

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IPC-9252A-CN: 未组装印制板电气测试要求

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J-004A-CN: SUPERSEDED BY J-STD-004B-CN

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IPC-DR-570A: General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards

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IPC-DR-572A: Drilling Guidelines for Printed Boards

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IPC-2316: Design Guide for Embedded Passive Device Printed Boards

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IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards

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IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

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IPC-5703: Cleanliness Guidelines for Printed Board Fabricators

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IPC-4203A: Cover and Bonding Material for Flexible Printed Circuitry

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IPC-4563: Resin Coated Copper Foil for Printed Boards Guideline

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IPC-4781: Qualification and Performance Specification of Permanent, Semi-Permanent and Temporary Legend and/or Marking Ink

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IPC-4811: Specification for Embedded Passive Device Resistor Materials for Rigid and Multilayer Printed Boards

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IPC-SM-840D: Qualification and Performance
Specification of Permanent Solder Mask