Standards: PCB Fabrication: Processes/Fabrication

121 Products

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IPC-9252A-CN: 未组装印制板电气测试要求

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T-50H-CN: 电子电路互连与封装术语及定义

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J-004A-CN: SUPERSEDED BY J-STD-004B-CN

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IPC-1601-CN: 印制板操作和贮存指南

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IPC-6012D-SP: Clasificación y especificación de rendimiento para los tableros impresos rígidos

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IPC-6012DS-SP: Adición de aplicaciones de aviónica militar y espacial del IPC-6012D, Clasificación y especificación de...

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IPC-6012DS-FR: Avenant pour les Applications Spatiales et Aéronautiques Militaires de l’IPC-6012D, Spécification de la Qualification...

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IPC-6012D-FR: Spécification de la Qualification et des Performances des Circuits Imprimés Rigides

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IPC-1601-DE: Handhabung und Lagerung von Leiterplatten

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IPC-6012DS-DE: Ergänzung zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten für Raumfahrt-Anwendungen

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IPC-6012D-DE: Qualifikation und Leistungsspezifikation für starre Leiterplatten

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J-004A: SUPERSEDED BY J-STD-004B

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IPC-DR-570A: General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards

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IPC-DR-572A: Drilling Guidelines for Printed Boards

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IPC-2316: Design Guide for Embedded Passive Device Printed Boards

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IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards

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A-52: Cleanliness and Residue Evaluation Test Board - Single User Download

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IPC-4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

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IPC-4761: Design Guide for Protection of Printed Board Via Structures

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IPC-4411A: Specification and Characterization Methods for Nonwoven Para-Aramid Reinforcement

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IPC-1710A: OEM Standard for Printed Board Manufacturer's Qualification Profile (MQP)

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IPC-SM-840E: Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials

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IPC-9631: User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation

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IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards