Standards: PCB Fabrication: Processes/Fabrication

146 Products

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IPC-6012DS-CN: 刚性印制板的鉴定及性能规范航天和军事航空电子应用补充标准

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IPC-6012D-CN: 刚性印制板的鉴定及性能规范

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IPC-6012DS-SP: Adición de aplicaciones de aviónica militar y espacial del IPC-6012D, Clasificación y especificación de...

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IPC-6012D-FR: Spécification de la Qualification et des Performances des Circuits Imprimés Rigides

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IPC-6012DS-DE: Ergänzung zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten für Raumfahrt-Anwendungen

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IPC-6012C-CN: 刚性印制板的鉴定及性能规范

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IPC-6012D-FR: Spécification de la Qualification et des Performances des Circuits Imprimés Rigides

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IPC-6012DS-DE: Ergänzung zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten für Raumfahrt-Anwendungen

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IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

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IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

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J-STD-048: Notification Standard for Product Discontinuance

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IPC-7092: Design and Assembly Process Implementation for Embedded Components

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IPC-7092: Design and Assembly Process Implementation for Embedded Components

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IPC-FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards

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IPC-4101D-WAM1: Specification for Base Materials for Rigid and Multilayer Printed Boards

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IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

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IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards

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IPC-5703: Cleanliness Guidelines for Printed Board Fabricators

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IPC-4203A: Cover and Bonding Material for Flexible Printed Circuitry

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IPC-4556: 印制板化学镍/钯/浸金(ENEPIG)规范

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IPC/JPCA-4921: Requirements for Printed Electronics Base Materials (Substrates)

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IPC-9850A: Surface Mount Placement Equipment Characterization

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IPC-SM-840E-CN: 永久性阻焊剂和挠性覆盖材料的鉴定和性能规范

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IPC-SM-840E: Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials