Standards: PCB Fabrication: Processes/Fabrication

161 Products

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J-STD-048: Notification Standard for Product Discontinuance

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IPC-7092: Design and Assembly Process Implementation for Embedded Components

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IPC-7092: Design and Assembly Process Implementation for Embedded Components

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IPC-FC-234A: Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards

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IPC-4101D-WAM1: Specification for Base Materials for Rigid and Multilayer Printed Boards

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IPC-2581B: Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

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IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards

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IPC-5703: Cleanliness Guidelines for Printed Board Fabricators

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IPC-4203A: Cover and Bonding Material for Flexible Printed Circuitry

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IPC-4556: 印制板化学镍/钯/浸金(ENEPIG)规范

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IPC/JPCA-4921: Requirements for Printed Electronics Base Materials (Substrates)

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IPC-9850A: Surface Mount Placement Equipment Characterization

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IPC-SM-840E: Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials

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IPC-SM-840E-CN: 永久性阻焊剂和挠性覆盖材料的鉴定和性能规范

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IPC-SM-840E: Qualification and Performance Specification of Permanent Solder Mask and Flexible Cover Materials

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IPC-9631: User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation

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IPC-1601-CN: 印制板操作和贮存指南

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IPC-1601-DE: Handhabung und Lagerung von Leiterplatten

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IPC-9151D: Process Capability, Quality and Relative Reliability (PCQR2) Benchmark Test Standard and Database

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IPC-6012D-DE: Qualifikation und Leistungsspezifikation für starre Leiterplatten

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IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards

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T-50H-CN: 电子电路互连与封装术语及定义

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IPC-6017: Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices

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IPC-586: Immersion Silver Plating Thickness Round Robin Investigation Data Set Compendium