Standards: PCB Fabrication: Quality/Test

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IPC-A-600J: Baskı Devre Kartlarının Kabul Edilebilirliği

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IPC-4101E: 刚性及多层印制板用基材规范

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IPC-9691B: IPC-TM-650 测试方法2.6.25耐导电阳极丝(CAF)及其他内部电化学迁移(ECM)测试用户指南

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IPC-6012D-SP: Clasificación y especificación de rendimiento para los tableros impresos rígidos

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IPC-A-600J-CN: 印制板的可接受性

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IPC-6012DA-CN: 刚性印制板的鉴定及性能规范汽车要求附件

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IPC-6018CS: Space and Military Avionics Applications Addendum to IPC-6018C Qualification and Performance Specification for High...

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IPC-6018C: Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

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IPC-6012C-CN: 刚性印制板的鉴定及性能规范

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IPC-6012DS-FR: Avenant pour les Applications Spatiales et Aéronautiques Militaires de l’IPC-6012D, Spécification de la Qualification...

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IPC-6012DA: Automotive Applications Addendum to IPC-6012D, Qualficiation and Performance Specification for Rigid Printed Boards

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IPC-6012D-FR: Spécification de la Qualification et des Performances des Circuits Imprimés Rigides

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IPC-A-600J-FR: Acceptabilité des Circuits Imprimés

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IPC-6012DS-DE: Ergänzung zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten für Raumfahrt-Anwendungen

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IPC-A-600J-DE: Abnahmekriterien für Leiterplatten

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IPC-4101E: Specification for Base Materials for Rigid and Multilayer Printed Boards

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IPC-9241: Guidelines for Microsection Preparation

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IPC-9252B: Requirements for Electrical Testing of Unpopulated Printed Boards

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IPC-A-600J: Acceptability of Printed Boards

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IPC-6012DS: Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid...

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IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards

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IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

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IPC-7092: Design and Assembly Process Implementation for Embedded Components

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J-STD-003C WAM1: Solderability Tests for Printed Boards