Standards: PCB Fabrication: Quality/Test

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IPC-6012D-CN: 刚性印制板的鉴定及性能规范

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IPC-9252A-CN: 未组装印制板电气测试要求

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T-50H-CN: 电子电路互连与封装术语及定义

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J-004A-CN: SUPERSEDED BY J-STD-004B-CN

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IPC-6012D-SP: Clasificación y especificación de rendimiento para los tableros impresos rígidos

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IPC-6012DS-SP: Adición de aplicaciones de aviónica militar y espacial del IPC-6012D, Clasificación y especificación de...

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IPC-A-600J-SP: Aceptabilidad de Tableros Impresos

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IPC-6012DS-FR: Avenant pour les Applications Spatiales et Aéronautiques Militaires de l’IPC-6012D, Spécification de la Qualification...

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IPC-6012D-FR: Spécification de la Qualification et des Performances des Circuits Imprimés Rigides

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IPC-6012DS-DE: Ergänzung zu IPC-6012D-DE Qualifikation und Leistungsspezifikation für starre Leiterplatten für Raumfahrt-Anwendungen

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IPC-6012D-DE: Qualifikation und Leistungsspezifikation für starre Leiterplatten

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IPC-A-600J-DE: Abnahmekriterien für Leiterplatten

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IPC-OI-645: Standard for Visual Optical Inspection Aids

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JP002: JEDEC/IPC Current Tin Whiskers Theory and Mitigation Practices Guideline

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J-004A: SUPERSEDED BY J-STD-004B

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IPC-DR-572A: Drilling Guidelines for Printed Boards

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IPC-5704: Cleanliness Requirements for Unpopulated Printed Boards

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IPC-9199: Statistical Process Control (SPC) Quality Rating

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IPC-9191: General Guidelines for Implementation of Statistical Process Control (SPC)

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IPC-6011: Generic Performance Specification for Printed Boards

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IPC-5701: Users Guide for Cleanliness of Unpopulated Printed Boards

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IPC-4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

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IPC-4761: Design Guide for Protection of Printed Board Via Structures

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IPC-9631: User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation