Standards: PCB Fabrication: Quality/Test

98 Products

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IPC-4821: Specification for Embedded Passive Device Capacitor Materials for Rigid and Multilayer Printed Boards

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IPC-4761: Design Guide for Protection of Printed Board Via Structures

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IPC-9631: User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation

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IPC-4412B: Specification for Finished Fabric Woven from "E" Glass for Printed Boards

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IPC-9641: High Temperature Printed Board Flatness Guideline

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IPC-7095C: Design and Assembly Process Implementation for BGAs

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IPC-4203A: Cover and Bonding Material for Flexible Printed Circuitry

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IPC-4101E: Specification for Base Materials for Rigid and Multilayer Printed Boards

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IPC-9241: Guidelines for Microsection Preparation

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IPC-9252B: Requirements for Electrical Testing of Unpopulated Printed Boards

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IPC-9691B: User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other...

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IPC-6018CS: Space and Military Avionics Applications Addendum to IPC-6018C Qualification and Performance Specification for High...

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IPC-6018C: Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

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IPC-A-600J: Acceptability of Printed Boards

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IPC-6012DA: Automotive Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid Printed Boards

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IPC-4556 AM1: Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards-Amendement 1

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IPC-6012DS: Space and Military Avionics Applications Addendum to IPC-6012D, Qualification and Performance Specification for Rigid...

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IPC-6012D: Qualification and Performance Specification for Rigid Printed Boards

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IPC-T-50M: Terms and Definitions for Interconnecting and Packaging Electronic Circuits

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IPC-7092: Design and Assembly Process Implementation for Embedded Components

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TM-650-MDP: Method Development Packet

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IPC-9201A: Surface Insulation Resistance Handbook

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IPC-4563: Resin Coated Copper Foil for Printed Boards Guideline

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IPC-5702: Guidelines for OEMs in Determining Acceptable Levels of Cleanliness of Unpopulated Printed Boards