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IPC-6018 Addendum

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IPC-6018DS

IPC-6018 - Revision D - Addendum - Space and Military

Space and Military Avionics Applications Addendum to IPC-6018D, Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

Document #:
IPC-6018
Revision
D
Product Type
Addendum
Released:  08/04/2022
Language
English
The IPC-6018DS addendum supplements or replaces specifically identified requirements of IPC-6018D, for high frequency (microwave) printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics. The IPC-6018DS addendum incorporates new requirements in areas such as copper wrap plating, dewetting, pad/land anomalies, copper cap plating...

IPC-6018 - Revision C - Addendum - Space and Military

Space and Military Avionics Applications Addendum to IPC-6018C Qualification and Performance Specification for High Frequency (Microwave) Printed Boards

Document #:
IPC-6018
Revision
C
Product Type
Addendum
Released:  08/09/2016
Language
English
This Addendum supplements or replaces specifically identified requirements of IPC-6018C, for high frequency (microwave) printed boards that must survive the vibration, ground testing and thermal cyclic environments of space and military avionics.
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IPC-6018 - Revision C - Addendum - Space and Military

高频（微波）印制板的鉴定及性能规范航天和军事航空电子应用补充标准

Document #:
IPC-6018
Revision
C
Product Type
Addendum
Released:  09/24/2019
Language
Chinese
Current Revision
本补充标准提供的要求，是对已发布的IPC-6018C 中要求的补充和某些情况下的替代， 以确保用于航天和军事航空电子设备中的印制电路板能够在振动、静态测试和热循环环境条件下的可靠性。2016年7月发布，2019年8月翻译。.
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Coming Soon

IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)

IPC-2294: Design Standard for Printed Electronics on Rigid Substrates

IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates

J-STD-005B: Requirements for Soldering Pastes

IPC-9691C: User Guide for the IPC-TM-650, Method 2.6.25 Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing

IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards

J-STD-609C: Marking and Labeling of Components, PCBs and PCBAs to Identify Lead (Pb), Lead-Free (Pb-free) and Other Attributes

IPC-4556A: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Boards

J-STD-004D: Requirements for Soldering Fluxes

IPC-4413: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards

IPC-HERMES-9852 Version 1.6: The Global Standard for Machine-to-Machine Communication in SMT Assembly