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The IPC-2551 standard is part of the IPC Factory of the Future standards establishing the IPC Digital Twin, which is comprised of the Digital Twin Product, Digital Twin Manufacturing and Digital Twin Lifecycle frameworks. Within the Digital Twin Architecture, the IPC-2551 standard stipulates and defines Digital Twin properties, types, complexities and readiness levels. The IPC Digital Twin...
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IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
J-STD-005B: Requirements for Soldering Pastes
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards
J-STD-004D: Requirements for Soldering Fluxes
IPC-4413: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards