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Document #:

IPC-T-50

Revision

Product Type

Standard Only

Released: 11/30/2021

Language

English

Current Revision

IPC-T-50N document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing English as a second language could understand the subtleties of the meaning. IPC-T-50N contains over 550 new or revised terms, including new terminology for via structures, surface mount device...

Document #:

IPC-A-600

Revision

Product Type

Standard Only

Released: 07/09/2020

Language

English

Current Revision

The definitive illustrated guide to printed board acceptability! This four-color document provides photographs and illustrations of the target, acceptable and nonconforming conditions that are either internally or externally observable on bare printed boards. Make sure your operators, inspectors, and engineers have the most current industry consensus information. With 120 new or revised...

Document #:

IPC-7711/21

Revision

Product Type

Standard Only

Released: 02/06/2024

Language

English

Current Revision

The IPC-7711/21 guide provides procedures for rework, repair and modification of printed board assemblies, including tools and materials, common procedures, coating removal and graphics to assist the user.

Document #:

IPC-7095

Revision

Product Type

Standard with amendment(s)

Released: 07/09/2019

Language

English

Current Revision

The IPC-7095D-AM1 standard describes design and assembly implementation for ball grid array (BGA) and fine-pitch BGA (FBGA) technology, focusing on inspection, repair and reliability issues associated with design and assembly of printed boards using these packages. IPC-7095D-AM1 provides the useful and practical information to those who use or are considering using BGAs. IPC-7095D-AM1 provides...

Document #:

IPC/JEDEC-J-STD-033

Revision

Product Type

Standard Only

Released: 04/04/2018

Language

English

Current Revision

IPC/JEDEC J-STD-033D provides surface mount device manufacturers and users with standardized methods for handling, packing, shipping and use of moisture/reflow sensitive components. These methods help avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation and damaged components. IPC/JEDEC J-STD-033D procedures provide a...

Document #:

IPC-SM-840

Revision

Product Type

Standard Only

Released: 12/22/2010

Language

English

Current Revision

Establishes the requirements for the evaluation of liquid and dry film solder mask material and for the determination of the acceptability of use on a standard printed board system. IPC-SM-840 provides two classes of requirements, T and H, to reﬂect functional performance requirements and testing severity based on industry/end use requirements. Coverage is given to adhesion, material qualification...

Document #:

IPC-6013

Revision

Product Type

Standard Only

Released: 09/16/2021

Language

English

Current Revision

IPC-6013E standard covers qualification and performance requirements for flexible printed boards designed to IPC-2221 and IPC-2223. The flexible printed board may be single-sided, double-sided, multilayer or rigid-flex multilayer. All of these constructions may include stiffeners, PTHs, microvias, and blind/buried vias. The IPC-6013E standard incorporates new and updated requirements for final...

Document #:

IPC-6012

Revision

Product Type

Standard Only

Released: 09/28/2023

Language

English

Current Revision

IPC-6012F, covers qualification and performance of rigid printed boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical...

Document #:

IPC-4101

Revision

Product Type

Standard with amendment(s)

Released: 04/14/2020

Language

English

Current Revision

IPC-4101E-WAM1 covers the requirements for base materials that are referred to as laminate or prepreg and listed in the specification sheets which are found after the main body of the standard. The specification sheets are to be used primarily for rigid and multilayer printed boards for electronic interconnections. The IPC-4101E-WAM1 standard contains 70 individual specification sheets that can be...

Document #:

IPC-2223

Revision

Product Type

Standard Only

Released: 01/24/2020

Language

English

Current Revision

IPC-2223E used in conjunction with IPC-2221, IPC-2223 establishes the specific requirements for the design of flexible printed boards and forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or non-reinforced dielectric in combination with metallic materials. IPC-2223E provides new design...

Document #:

IPC-1791

Revision

Product Type

Standard Only

Released: 11/01/2023

Language

English

Current Revision

IPC-1791D standard provides minimum requirements, policies and procedures for printed board design, fabrication, assembly, and cable and wire harness assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. These trusted sources shall ensure quality, supply chain risk management (SCRM), security and...

Document #:

IPC/JEDEC-J-STD-020

Revision

Product Type

Standard Only

Released: 02/16/2023

Language

English

Current Revision

IPC/JEDEC J-STD-020F standard is to identify the classification level of nonhermetic SMDs designed for surface mount assembly that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations. IPC/JEDEC J-STD-020F standard may be used to determine what classification level...

Document #:

IPC-6018

Revision

Product Type

Standard Only

Released: 03/01/2022

Language

English

Current Revision

The IPC-6018D standard covers qualification and performance of high frequency (microwave) boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as...

Document #:

EIA/IPC/JEDEC-J-STD-002

Revision

Product Type

Standard Only

Released: 11/01/2017

Language

English

Current Revision

IPC-J-STD-002E prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs, and tabs. The IPC-J-STD-002E standard also includes a test method for the resistance to dissolution/dewetting of metallization. IPC-J-STD-002E is intended for use by both supplier and user...

Document #:

IPC-D-350

Revision

Product Type

Standard Only

Released: 07/01/1992

Language

English

Current Revision

This document bears two reference numbers, and may be obtained from IPC or the IEC. IPC-D-350D and IEC 1182-1 are identical in technical content. The IEC version of this document also contains a French translation. The IEC is responsible for the accuracy of that translation. Specifies record formats used to describe printed board products with detail sufficient for tooling, manufacturing and...

Document #:

IPC-4552

Revision

Product Type

Standard Only

Released: 07/27/2021

Language

English

Current Revision

IPC-4552B standard sets the requirements for Electroless Nickel / Immersion Gold (ENIG) deposit thickness for applications including soldering, wire bonding, and as a contact finish. IPC-4552B standard is used to specify acceptance criteria to meet performance standards for IPC-6010 family of documents including IPC-6012, IPC-6013 and IPC-6018. The ENIG deposit specified using this document will...

Document #:

IPC-7094

Revision

Product Type

Standard Only

Released: 02/14/2018

Language

English

Current Revision

IPC-7094A describes the design and assembly challenges for implementing flip chip technology in a direct chip attach (DCA) assembly. The effect of bare-die or die-size components in a flip chip format has an impact on component characteristics and dictates the appropriate assembly methodology. The IPC-7094A standard focuses on design, assembly methodology, critical inspection, repair and...

Document #:

IPC-7093

Revision

Product Type

Standard Only

Released: 11/30/2020

Language

English

Current Revision

The IPC-7093A standard provides essential design and assembly guidance for implementing bottom termination components (BTCs). Specifically, IPC-7093A provides guidelines on critical design, materials, assembly, inspection, repair, quality, and reliability issues associated with BTCs.

Document #:

IPC-7351

Revision

Product Type

Standard Only

Released: 07/01/2010

Language

English

Current Revision

This popular document covers land pattern design for all types of passive and active components, including resistors, capacitors, MELFs, SOPs, QFPs, BGAs, QFNs and SONs. The standard provides printed board designers with an intelligent land pattern naming convention, zero component rotations for CAD systems and three separate land pattern geometries for each component that allow the user to select...

Document #:

IPC-4202

Revision

Product Type

Standard Only

Released: 03/01/2022

Language

English

Current Revision

The IPC-4202C standard covers the requirements for flexible base materials, herein referred to as laminates, prepregs or films, to be used primarily for flexible printed boards for electrical and electronic circuits

Document #:

IPC-4204

Revision

Product Type

Standard Only

Released: 09/05/2018

Language

English

Current Revision

IPC-4204B establishes the classification system, the qualification and quality performance requirements for flexible metal-clad dielectric materials to be used for the fabrication of flexible printed boards. It encompasses 12 specification sheets that result from the combinations of various copper foil claddings; a polymer base dielectric selected from polyesters, polyimides, liquid crystal...

Document #:

IPC-4203

Revision

Product Type

Standard Only

Released: 03/01/2018

Language

English

Current Revision

IPC-4203B establishes the classification system, the qualification and quality conformance requirements for dielectric films coated with an adhesive on one or both sides, which are to be used as cover material and/or bondply for flexible printed circuitry, as well as supported or unsupported adhesive films to be used in the fabrication of flexible printed circuitry. IPC-4203B does not cover non...

Document #:

IPC-2226

Revision

Product Type

Standard Only

Released: 10/12/2017

Language

English

Current Revision

IPC-2226A, Sectional Design Standards for High Density Interconnect (HDI) Printed Boards is used in conjunction with IPC-2221B. The IPC-2226A standard establishes requirements and considerations for the design of high density interconnect (HDI) printed boards and microvia technology. Revision A constitutes a substantial update to the document, with an all new color key for HDI constructions, new...

Document #:

IPC-2222

Revision

Product Type

Standard Only

Released: 10/07/2020

Language

English

Current Revision

IPC-2222B used in conjunction with IPC-2221, establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. The IPC-2222B standard applies to single-sided, double-sided, or multi-layered boards. Key concepts in IPC-2222B are rigid laminate properties, design requirements for printed board assembly and...

Document #:

IPC-2221

Revision

Product Type

Standard Only

Released: 12/14/2023

Language

English

Current Revision

IPC-2221C is the foundation design standard for all documents in the IPC-2220 series. It establishes the generic requirements for the design of printed boards and other forms of component mounting or interconnecting structures, whether single-sided, double-sided or multilayer. Among the many updates to Revision C are new guidance and requirements on material and copper foil selection...