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Document #:

IPC-WP-023

Revision

Original Version

Product Type

White Paper

Released: 05/01/2018

Language

English

Current Revision

IPC-WP-023 is an IPC Technology Solutions White Paper addressing reliability issues associated with stacked microvias. There is evidence that staggering vias can result in a more robust structure; however, staggering microvias is only a temporary solution to accommodate complex designs with microvias built with weak interface structures IPC-WP-023 white paper provides an investigation of these...

Document #:

IPC-WP-026

Revision

Original Version

Product Type

White Paper

Released: 12/05/2019

Language

English

Current Revision

The IPC-WP-026 white paper explores blockchain as an emerging technology that has a core strength in providing an immutable, auditable, transparent and secure environment for data exchanges. These advantages make it a prime candidate for implementation in the electronics industry. The IPC-WP-026 white paper explores blockchain and its limitations and challenges. It also provides a few directions...

Document #:

IPC-WP-024

Revision

Original Version

Product Type

White Paper

Released: 08/16/2018

Language

English

Current Revision

IPC-WP-024 is a white paper which discusses the issues associated with reliability of smart textiles (e-textiles structures) following multiple washing cycles and emphasizes efforts that industry and research laboratories must undertake to make e-textile structures more robust and able to be washed similarly to everyday textile products (e.g., underwear, clothing, home textiles and technical...

Document #:

IPC-WP-025

Revision

Original Version

Product Type

White Paper

Released: 04/01/2019

Language

English

Current Revision

This white paper is a benchmarking exercise of e-textile integrations, providing an introductory categorization of how the current market sector is using textile-based electrical components to achieve integrated functionality. This peer assessment provides a baseline understanding of e-textile process techniques, requirements and resources within this emerging sector.

Document #:

IPC-WP-004

Revision

Original Version

Product Type

White Paper

Released: 08/01/1994

Language

English

Current Revision

Addresses the complete process of reengineering new product development processes to incorporate DFX methodologies. Presents the case for a comprehensive analysis of the key business issues and definition of requirements before initiating work to refine or restructure processes. Editor, Dieter Bergman, IPC. 88 pages. Released by the Surface Mount Council, April 1997.

Document #:

IPC-WP-003

Revision

Original Version

Product Type

White Paper

Released: 08/01/1993

Language

English

Current Revision

Status of the technology discussion on the various methodologies for mounting and interconnecting active devices to a variety of substrate materials is summarized in this document. Reviews mounting techniques of tape automated bonding (TAB), chip on board (COB) and flip chip. Examinations of the most commonly used substrate options of laminate, ceramic and silicon are also reviewed. Editor: John...

Document #:

IPC-RFP

Revision

Original Version

Product Type

White Paper

Released: 01/18/2012

Language

English

Current Revision

"Is Your RFP D.O. A." was presented at the IPC Conference for the PCB Industry: Critical Issues for the Military Market in December 2011 by Steve DeWaters, president, Penumbra Strategies, Inc. The author describes the procedures of the military in preparing an RFP and evaluating the proposals. He also describes the procedures to create an effective response to the RFP and some of the pitfalls of...

Document #:

IPC-WP-024

Revision

Original Version

Product Type

White Paper

Released: 04/16/2019

Language

Chinese

Current Revision

IPC-WP-024是一份白皮书，讨论了多次洗涤循环后智能织物（电子织物结构）可靠性相关的问题，并强调了工业和研究实验室必须做出的努力。以使电子织物结构更加坚固，能够像市场上的日常织物（例如，内衣、服装、家用织物和技术织物）一样被清洁或洗涤。研究人员在商用洗衣机和家用洗衣机洗涤剂多次洗涤循环后，为电子织物提供实验室测试的初始可靠性结论。