A-20/21: Standard Pitch Stencil Pattern for Slump
Provided electronically, these Gerber Files include patterns for developing solder paste stencils by laser or chemical etching. Land widths of 0.4 mm, 0.63mm and 1.25 mm are provided with varying pitch in order to evaluate solder paste slump. J-STD-005 included with each order. Available in Gerber data only.