IPC-6018: Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
The IPC-6018 standard covers qualification and performance of high frequency (microwave) boards, including single-sided, double-sided, with or without plated-through holes, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surface plating coating requirements, conductors, holes/vias, frequency of acceptance testing and quality conformance as well as electrical, mechanical and environmental requirements.
Featured Documents
IPC-6018 Standard Only
The base standard that establishes the guidance for building and manufacturing better electronics.
IPC-6018 Addendum
Addendums provide industry specific guidance that build on top of the guidance provided by the base standard, and they have to be used in conjunction with the base standard.
Coming Soon
IPC-7095E: Design and Assembly Process Implementation for Ball Grid Arrays (BGAs)
IPC-2294: Design Standard for Printed Electronics on Rigid Substrates
IPC-6904: Qualification and Performance Specifications for Printed Electronics on Rigid Substrates
J-STD-005B: Requirements for Soldering Pastes
IPC-4105: Specification for Metal Base Copper Clad laminates for Rigid Printed Boards
J-STD-004D: Requirements for Soldering Fluxes
IPC-4413: Specification for Finished Fabric Woven from Low Dk Glass for Printed Boards